Research

The chair for microsystems technology is currently pursuing four focal points, which largely overlap, particularly in terms of the technology base. A dedicated clean room is available for this purpose, which was built in 2010 and fundamentally revised in 2017 - 2019 due to significant structural defects and upgraded for the processing of wafers up to 200 mm. In addition, devices in the center for interface-dominated high-performance materials are looked after and used, in particular the systems available there for plasma-based etching, and there is an active cooperation with the IMN MacroNano^® and ZMN of the TU Ilmenau.

"Phantasie ist wichtiger als Wissen, denn Wissen ist begrenzt. Phantasie aber umfasst die ganze Welt."
Albert Einstein

Projects

Publications

Bunte Puzzelteile als Metapher für Teamwork und Kooperation (© Adobe Stock)

Cooperations

Microactuators

Complex micro-actuator system concepts are researched mainly on the basis of the "silicon-on-insulator" technology (SOI). The focus is on electrostatic principles and also include fluidic systems that move drops by means of dielectric effects.

Energy self-sufficient microsensors

Our approach aims to do without electrical auxiliary energy for amplification, storage and AD conversion.

Two-dimensional material systems for electronics and sensors

2D materials are a relatively young class of materials that consist of very thin, ideally monolayer, but still crystalline layers. A special feature is that different layers can be combined here even if their crystal lattices are not adapted.

Micro-nano integration

This topic forms one of the long-term, overarching focal points of our own research. It is becoming apparent that, within the framework of the More-than-Moore strategy, the integration of post-CMOS nanostructures on microelectronic wafers will play a key role.

Optical microsystems

Optical microsystems form a continuous focus of research activities. Starting with waveguide systems for sensors and optical communication technology to emitters and absorbers for long-wave infrared technology.

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ForLab

In the project, an innovative, monolayer-precise deposition and etching technology at low temperatures for the production of cost-effective, flexible microelectronics and ultra-sensitive microsensors is being developed and implemented in a 200 mm cluster system on substrates.

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