Prof. Dr.-Ing. Georg Schmitz


Ruhr-Uni­ver­si­tät Bo­chum
Fakultät für Elektrotechnik und Informationstechnik
Postfach ID 22
Uni­ver­si­täts­stra­ße 150
D-44801 Bo­chum

ID 04/233

(+49)(0)234 / 32 - 27573

(+49)(0)234 / 32 - 14872




Georg Schmitz was born in Mül­heim a.d. Ruhr, Ger­ma­ny. He re­cei­ved the Dipl.-Ing. de­gree in 1990 and the Dr.-Ing. de­gree in 1995 in elec­tri­cal en­gi­nee­ring from Ruhr-Uni­ver­si­tät Bo­chum, Ger­ma­ny.

From 1995 to 2001 he was with Phi­lips Re­se­arch La­bo­ra­to­ries of Royal Phi­lips Elec­tro­nics, in Ham­burg and Aa­chen as a Prin­ci­pal Sci­en­tist. From 2001 to 2004 he was Pro­fes­sor for Me­di­cal En­gi­nee­ring at the Uni­ver­si­ty of Ap­p­lied Sci­ence Ko­blenz. Since 2004 he has been Pro­fes­sor for Elec­tri­cal En­gi­nee­ring and holds the Chair for Me­di­cal En­gi­nee­ring at Ruhr-Uni­ver­si­ty Bo­chum, Ger­ma­ny. From 2009 to 2012 he was Dean of the Fa­cul­ty for Elec­tri­cal En­gi­nee­ring and In­for­ma­ti­on Tech­no­lo­gy, and is mem­ber of the Se­na­te of Ruhr-Uni­ver­si­tät Bo­chum since 2014.

His re­se­arch in­te­rests are in the field of ul­tra­so­nic ima­ging and image processing with cur­rent re­se­arch pro­jects on ul­tra­sound con­trast media de­tec­tion and super-resolution imaging, novel be­am­for­ming algorithms, non­line­ar re­con­struc­tion me­thods, and pho­toa­coustic ima­ging.

Prof. Schmitz is Se­ni­or Mem­ber of the IEEE, mem­ber of the Acousti­cal So­cie­ty of Ame­ri­ca (ASA), the Ger­man As­so­cia­ti­on of Elec­tri­cal En­gi­neers (VDE), and of the World, Eu­ropean and Ger­man So­cie­ties of Ul­tra­sound in Me­di­ci­ne and Bio­lo­gy (WFUMB, EF­SUMB, DEGUM). He ser­ves as as­so­cia­te edi­tor for the IEEE Tran­sac­tions of Ul­tra­so­nics, Fer­ro­elec­trics, and Fre­quen­cy Con­trol and is mem­ber of the Edi­to­ri­al Ad­vi­so­ry Board of Ul­tra­sound in Me­di­ci­ne and Bio­lo­gy. From 2013-2015 he ser­ved as vice chair (me­di­cal ul­tra­sound) of the tech­ni­cal pro­gram com­mit­tee of the IEEE In­ter­na­tio­nal Ul­tra­so­nics Sym­po­si­um and as tech­ni­cal pro­gram chair of the 2017 ans 2022 IEEE In­ter­na­tio­nal Ul­tra­so­nics Sym­po­si­a.